Research 2: 126A
Equipment
- Milara Stencil/Screen Printer
BOND TESTER LEAD PULL INSPECTION- 8028 PPS GOLD BALL WIREBONDER
HARDNESS TESTER, MICRO-IDENTIFIER- MYDATA Pick and Place Machine
- Electrovert Bravo Reflow Oven
- Austin America Flux Aqueous Cleaner
- Dage Bond Tester Wire and ribbon pull, Ball Shear, Die Shear
- ESPEC Vacuum Oven
- Micro Hardness Tester
- High Force Die Attach Machine Shibaura TFC1000
- Rework/De-soldering Station Metcal
- Smartscope Flash Optical Measurement system
- DEK Horizon 265 Stencil and Screen Printer
- Semi Automatic Die Placement machine Tresky
- Low Force Die Bonder Shibaura TFC1000
- Solderball Attach Tooling
- Microhardness Tester