Description:

Temperature cycling is similar to temperature shock testing, with the difference being that temperature cycling has slower transitions between temperature extremes. Two chambers were acquired; the larger unit is appropriate for cycling printed circuit board assemblies while the small unit is appropriate for individual devices. Both chambers provide standards-compliant conditions for air-to-air testing.

Contact Person: Fred Haring

Department: RCA Research Operations Core

Building: Research 2

Room: 112

Availability: Available - Recharge Center