Temperature cycling is similar to temperature shock testing, with the difference being that temperature cycling has slower transitions between temperature extremes. Two chambers were acquired; the larger unit is appropriate for cycling printed circuit board assemblies while the small unit is appropriate for individual devices. Both chambers provide standards-compliant conditions for air-to-air testing.

• Department: RCA Research Operations Core
• Building:Research 2
• Room:112
• Contact Person: Fred Haring
• Availability: Available - Recharge Center