Produces a clean polished cross section of almost any material at 90 degrees to the sample surface--ideal for measurement of multilayered structures. Useful for difficult-to-polish soft materials (Cu, Al, Au, solder, polymers) as well as difficult-to-cut hard materials (ceramic, glass, Si) and composites.

• Department: RCA Electron Microscopy Core
• Building:USDA Northern Crop Science Laboratory
• Room:
• Contact Person: Scott Payne
• Availability: Available - Recharge Center