Description: XD7600NT X-ray Imaging System DAGE Precision Industries XD7600NT X-ray Imaging System is a state-of-the-art inspection tool with submicron feature recognition. X-ray inspection is a critical component in surface mount technology (SMT) and chip scale packaging (CSP). X-ray inspection for SMT processes include solder joints, BGA placement, and solder bridging, while inspection for CSP processes include examination of wire bond connections and wire shorts. Applications § Anthropolgy: fossil examination § Electronics: examination of mounted and packaged electronic parts § Engineering: examination of manufactured parts § Geology: electron density variation in rock specimen § Zoology: examination of skeletal structures of deceased animals Features § 250nm (0.25 micron) feature recognition § 2-Mpixel images with > 65,000 grayscale levels § Automatic BGA and die-void measurements § Comprehensive data logging and reporting facilities § Enhanced automated inspection routines § Uninterrupted rotating live oblique views 300 degrees around any point in the sample § Up to 70 degree oblique angle views over the entire inspection area

Contact Person: Fred Haring

Department: RCA Research Operations Core

Building: Research 2

Room: 124A

Availability: Available - Recharge Center